Advanced Development Engineer Engineering - Lehi, UT at Geebo

Advanced Development Engineer

Company Name:
IM Flash Technologies
Title: Advanced Development Engineer
Location: Utah-Lehi
About IM Flash Technologies:
IM Flash Technologies is a joint venture of Micron Technology and Intel, formed to manufacture NAND Flash memory for use in consumer electronics, removable storage, and handheld communication devices. IM Flash combines Micron's leadership in process and product technology with Intel's multi-level cell technology and history of innovation in Flash memory to successfully compete in the NAND Flash memory business, an increasingly important and fast growing market segment.
Advanced Development Engineer:
As an Advanced Development Engineer at IM Flash Technologies, LLC you will be responsible for critical device and process projects to further progress our NAND Flash technology lead. Technical contributions and effective communication within multifunctional groups will be an integral part of your activity. Participation in the deployment of our new product technologies will offer many opportunities for continuing your technical career development.
Responsibilities include, but are not limited to:
Engage in and lead cross-area engineering teams to solve complex and challenging integration issues with NAND flash performance.
Use understanding of semiconductor process technologies and device physics to innovate solutions to complex integration problems.
Design, execute, and analyze advanced process experiments to drive understanding of root cause and optimize process conditions.
Work closely with Yield Enhancement, Process Engineering, Research & Development, and Product Engineering teams to determine root cause of specific yield issues and implement corrective actions.
Understand strategies for yield improvement, mentor others in applying those strategies, and develop new methods and techniques for process characterization and yield improvement.
Develop and drive technical expertise in the group by teaching short technical courses and fielding Q&A sessions.
Actively contribute to a safe and positive working environment and promote our core values: integrity, teamwork, execution, and commitment.
Advanced understanding of device physics.
Demonstrated history in driving solutions to integrated problems in semiconductor manufacturing.
Strong structural and process integration knowledge with sufficient comprehension of process areas like Photolithography, Films (Diffusion, Chemical Vapor Deposition, Physical Vapor Deposition), Chemical Mechanical Planarization, Wet Process, Dry Etch, and Implant.
Excellent data analysis skills used to troubleshoot and optimize advanced process and device physics issues.
Successfully demonstrated skill in communicating highly technical information to large groups.
Advanced understanding of fabrication statistical process controls.
Proven ability to make sound decisions independently and work with minimal supervision.
Skilled at effectively prioritizing multiple and complex tasks.
Sets a behavioral example by being a proactive problem solver, communicating openly, and taking responsibility for decisions.
Proven ability to be flexible with job responsibilities and take the initiative to assume added ownership.
May require short term and temporary relocation as you work with research and development activities across our worldwide network.
Demonstrated teamwork skills with a strong focus on developing good team dynamics.
M.S. or better in Electrical Engineering, Physics, or equivalent experience is required. NAND Flash process experience is preferred.
All Team members must meet minimum criminal background standards as established by IMFT and the Department of Homeland Security.Estimated Salary: $20 to $28 per hour based on qualifications.

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